I. Product Overview
CYD-T58 is a novel dendritic product characterized by a highly branched, quasi-spherical structure featuring multiple hydroxyl functional groups on its surface. It is designed for application in adhesive and coating systems—such as those based on epoxy resins and polyurethanes—where it functions as a crosslinking agent, exhibiting unique performance characteristics. Not only does it improve the crosslinked structure of the system to effectively enhance coating toughness, but it also significantly boosts properties such as coating adhesion and tensile shear strength.
II. Physical Property Specifications
III. Product Characteristics
1. Contains a high concentration of active hydroxyl groups, enabling multi-dimensional participation in crosslinking. This modifies the crosslinking structure of the coating, thereby efficiently enhancing coating toughness by over 20%, and boosting the tensile shear strength of epoxy adhesives by more than 30%.
2. Thanks to the multiple active sites provided by its multi-branched structure, it increases the interaction between the coating and the substrate, effectively improving the adhesion of the coating to metal and other substrate surfaces.
3. It enhances the performance of water-based coatings, specifically improving their resistance to water, acids, and alkalis.
IV. Typical Data and Application Cases
1. Application of CYD-T58 as a Crosslinking Modifier
Raw Materials: E51 Epoxy Resin, 650 (Polyamide Curing Agent), CYD-T58, DMP-30 (Tertiary Amine Curing Accelerator);
Test Formulation: E51 : 650 = 100 : 100
When used as a crosslinking modifier in conjunction with a 650-series polyamide curing agent, CYD-T58 can increase the tensile shear strength of an adhesive by over 20% on both PC substrates and steel substrates.
2. CYD-T58 Prepolymer-Modified Epoxy Resin
With a CYD-T58 addition level of 5% by weight relative to the epoxy resin and a reaction temperature of 100°C, the resulting Prepolymer A appears as a clear, transparent liquid after 4 hours of reaction, exhibiting a viscosity of 10,800 mPa·s (compared to the 11,000–12,000 mPa·s viscosity of the base E51 resin).
Test Formulation: E51 / Prepolymer A : Methyltetrahydrophthalic Anhydride = 10 : 8.5. Curing Conditions: 120°C for 4 hours.
Compared to pure E51 epoxy resin, the epoxy resin modified via prepolymerization with CYD-T58 demonstrates an improvement in adhesion from 3B to 5B, and a 43% increase in impact resistance.
3. Typical Case Study
Application System: One-component epoxy electronic adhesive.
Application Method: Add T58 at a ratio of 10% by weight of the epoxy resin into the system and mix thoroughly. The adhesive storage temperature should be maintained at -20°C.
Application Results: Significantly improves the peel strength of the adhesive and enhances adhesion.
5. Recommended Usage Methods and Addition Levels
A. Used directly as a crosslinking agent: The addition level should be within 10% (adjusted specifically based on performance requirements). It serves to improve mechanical properties, such as impact resistance.
B. Used as an epoxy resin modifier: Recommended reaction temperature is 100–120°C, with a reaction time of 2–4 hours. The addition level is 1–5% of the epoxy resin weight (adjustable based on performance requirements).
C. Used as an accelerator for amine-based curing agents: The addition level should be within 5% (adjusted specifically based on performance requirements). It serves to accelerate curing and enhance performance.
6. Recommended Application Fields
Suitable for two-component epoxy systems (utilizing curing agents such as anhydrides or amines) as well as one-component epoxy adhesive systems requiring low-temperature storage. It can also be applied in polyurethane coating or adhesive systems, serving as a partial replacement for polyols. Specific applications include electronic adhesives for devices such as mobile phones and other electronics, rail transit systems, and adhesives for 5G-related industries.
7. Storage
Store in a sealed, dry environment at room temperature. Avoid contact with strong bases, strong acids, strong oxidizing agents, etc. Shelf life: 24 months.
8. Packaging Specifications
Packaging: 25 kg/drum.
The recommendations and data provided above are derived from reliable sources. These constitute advice only and do not constitute a guarantee. Given the numerous variables involved—including formulation, manufacturing processes, and application environments—users are advised to conduct preliminary trials to confirm suitability. Chenyuan Molecular makes no warranties, express or implied, and assumes no liability for any consequences arising from the use of this product. Chenyuan Molecular expressly disclaims any implied warranties of fitness for a particular purpose.
